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Global Mixed-mode Technology Inc.
G965
1.5A Low Dropout Regulator with Enable
Features
Adjustable Output from 1.2V to 4.8V Using External Resistors 1.5V, 1.8V and 2.5V Options by Setting ADJ Pin Below 0.2V Over Current and Over Temperature Protection 500mV Dropout @1.5A Enable Pin 10A Quiescent Current in Shutdown SOP-8 Package Notebook Computers
General Description
The G965 is a high performance positive voltage regulator designed for use in applications requiring very low dropout voltage at up to 1.5 Amps. Since it has superior dropout characteristics compared to regular LDOs, it can be used to supply 2.5V on motherboards or 1.5V, 1.8V on peripheral cards from the 3.3V supply thus allowing the elimination of costly heatsinks. An enable pin further reduces power dissipation while shut down. The G965 provides excellent regulation over variations in line, load and temperature. The SOP-8 is available with 1.5V, 1.8V and 2.5V internally preset outputs that are also adjustable using external resistors.
Applications
Battery Powered Systems Motherboards Peripheral Cards Network Cards Set Top Boxes Medical Equipment
Ordering Information
ORDER NUMBER
G965-15ADJP1U G965-18ADJP1U G965-25ADJP1U
ORDER NUMBER (Pb free)
G965-15ADJP1Uf G965-18ADJP1Uf G965-25ADJP1Uf
MARKING
G965-15 G965-18 G965-25
TEMP. RANGE
-40C ~ +85C -40C ~ +85C -40C ~ +85C
PACKAGE
SOP-8 SOP-8 SOP-8
Note: P1: SOP-8
U : Tape & Reel e.g. 18 denotes the 1.8V output voltage.
Pin Configuration
Typical Application Circuit
G965
VEN VIN VO ADJ 1 2 3 4 8 7 6 5 GND GND GND GND
R3 VEN VIN VO R1 C1 22F C2 47F R2
IENH
G965
VEN VIN VO ADJ GND
SOP-8
1.2 (R1+R2)
VO =
Volts R2 R2=12k is recommended R3 should be connected for current IENH restriction as VEN > VIN+0.3V
Ver: 1.5 Apr 01, 2005
TEL: 886-3-5788833 http://www.gmt.com.tw
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Global Mixed-mode Technology Inc.
Absolute Maximum Ratings (Note 1) Input Voltage....................................................7V VEN Voltage.............................................VIN+0.3V Power Dissipation Internally Limited (Note 2) Maximum Junction Temperature.....................150C Storage Temperature Range........-65C TJ +150C Reflow Temperature (soldering, 10sec)...........260C Thermal Resistance Junction to Ambient, (JA) SOP-8...................................................162C/W Thermal Resistance Junction to Case, (JC) SOP-8.......................................................31C/W ESD Rating (Human Body Model)......................2kV Electrical Characteristics
G965
Operation Conditions (Note 1) Input Voltage.........................................2.2V ~5.5V Temperature Range......................-40C TA +85C
VEN=VIN, VIN =5V, IO = 0.5A, CIN = 4.7F, COUT =10F, TA = TJ = 25C unless otherwise specified (Note 3) PARAMETER
Supply Voltage Output Voltage Line Regulation Load Regulation Quiescent Current Ripple Rejection Dropout Voltage Short Circuit Current Over Temperature VEN Voltage High VEN Voltage Low VEN Bias Current Low ADJ Reference Voltage ADJ Pin Threshold VENH VENL IENL VREF Output Active Output Disabled VEN=0.4V VIN=2.2V, VADJ=VOUT, IO=10mA VD
SYMBOL
VIN VO
CONDITION
VIN=VO +0.7V, IO=10mA VO+0.7V < VIN < 5.5V, IO=10mA 10mA < IO < 1.5A VIN=3.3V,VEN=VIN VIN=3.3V,VEN=0V fi=120Hz, 1VP-P, IO=100mA IO=1.5A
MIN
2.2 -2 ----------------1.6 ----1.188 ---
TYP
--VO 0.2 0.8 1.7 16 55 0.5 0.8 150 ------1.2 0.2
MAX
5.5 2 2 2 2.5 35 --0.65 ------0.4 20 1.212 ---
UNIT
V % % % mA A dB V A C V V A V V
IQ
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics. Note2: The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resistance, JA, and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is (Tjmax-TA) / JA. If this dissipation is exceeded, the die temperature will rise above 150C and IC will go into thermal shutdown. Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. Note4: The type of output capacitor should be tantalum or aluminum.
Definitions
Dropout Voltage The input/output Voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 2% below its nominal value, dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Line Regulation The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly affected. Load Regulation The change in output voltage for a change in load current at constant chip temperature. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly affected. Maximum Power Dissipation The maximum total device dissipation for which the regulator will operate within specifications. Quiescent Bias Current Current which is used to operate the regulator chip and is not delivered to the load.
TEL: 886-3-5788833 http://www.gmt.com.tw
Ver: 1.5 Apr 01, 2005
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Global Mixed-mode Technology Inc.
Typical Performance Characteristics
VEN=VIN, VIN =5V, IO = 0.5A, CIN = 4.7F, COUT =10F, TA = TJ = 25C
Line Transient(G965-15)
G965
Load Transient(G965-15)
Line Transient Response(G965-18)
Load Transient Response(G965-18)
Line Transient Response(G965-25)
Load Transient Response(G965-25)
Ver: 1.5 Apr 01, 2005
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Global Mixed-mode Technology Inc.
Typical Performance Characteristics (continued)
G965
Start-UP(G965-15)
Overcurrent Protection Characteristics(G965-15)
Start-up(G965-18)
Overcurrent Protection Characteristics(G965-18)
Start-up(G965-25)
Overcurrent Protection Characteristics(G965-25)
Ver: 1.5 Apr 01, 2005
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Global Mixed-mode Technology Inc.
Typical Performance Characteristics (continued)
G965
Quiescent Current vs. Temperature(G965-15)
1.7 1.65 Quiescent Current (mA) 1.6 1.55 1.5 1.45 VIN=3V 1.4 1.35 1.3 -25 -15 -5 5 15 25 35 45 55 65 75 85 Temperature (C) VIN=5V Dropout Voltage (mV)
Dropout Voltage vs.Temperature(G965-15)
700 600 500 400 300 200 100 0 -25 -15 -5 5 15 25 35 45 55 65 75 85 Temperature (C) IL=300mA IL=1A
Quiescent Current vs. Temperature(G965-18)
2.00 1.95 Quiescent Current (mA) 1.90 Dropout Voltage (mV) 1.85 1.80 1.75 1.70 1.65 1.60 1.55 1.50 -25 -15 -5 5 15 25 35 45 55 65 75 85 Temperature (C) 100 0 0 VIN=3V VIN=5V 500 400 700 600
Dropout Voltage vs. IL(G965-18)
T=85C T=25C
300 200 T=-25C
250
500
750 1000 IL (mA)
1250
1500
Quiescent Current vs. Temperature(G965-25)
4.00 3.75 Quiescent Current (mA) Dropout Voltage (mV) 3.50 VIN=5V 3.25 3.00 2.75 2.50 -25 -15 -5 5 15 25 35 45 55 65 75 85 Temperature (C) 700 600 500
Dropout Voltage vs. IL(G965-25)
T=85C 400 300 200 100 0 0 0.25 0.5 0.75 IL (A) 1 1.25 1.5 T=-25C T=25C
VIN=4V
Ver: 1.5 Apr 01, 2005
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Global Mixed-mode Technology Inc.
Typical Performance Characteristics (continued)
G965
Output Voltage vs. VIN(G965-15)
Output Voltage vs. Temperature(G965-15)
1.54 1.53 Output Voltage (V) 1.52 1.51 1.5 1.49 1.48 -25 -15 -5 5 15 25 35 45 55 65 75 85 Temperature (C) VIN=3V IL=10mA
1.54 1.53 Output Voltage (V) 1.52 1.51 1.5 1.49 1.48 2.5 3 3.5 4 4.5 VIN (V) 5 5.5
T=-25C IL=10mA
VIN=5V
T=25C
T=85C
Output Voltage vs. Temperature(G965-18)
1.824 1.819 Output Voltage (V) 1.814 1.809 1.804 1.799 1.794 1.789 1.784 -25 -15 -5 5 15 25 35 45 55 65 75 85 Temperature (C) 1.8 2.5 VIN=3V IL=10mA 1.82 Output Voltage (V) VIN=5V 1.825
Output Voltage vs. VIN(G965-18)
IL=10mA
T=85C 1.815
1.81 T=25C 1.805 T=-25C 3.5 4.5 VIN (V) 5.5 6.5
Output Voltage vs. Temperature(G965-25)
2.545 2.545 IL=10mA 2.535 Output Voltage (V) 2.525 2.515 2.505 2.495 2.485 2.475 -25 -15 -5 5 15 25 35 45 55 65 75 85 Temperature (C) VIN=4V Output Voltage (V) VIN=5V 2.540 2.535 2.530 2.525 2.520 2.515 2.510 2.505 2.500
Output Voltage vs. VIN(G965-25)
IL=10mA
T=85C
T=25C
T=-25C
3
4
5 VIN (V)
6
7
Ver: 1.5 Apr 01, 2005
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Global Mixed-mode Technology Inc.
Typical Performance Characteristics (continued)
G965
Ripple Rejection
Short Circuit Current
60 50 Ripple Rejection (dB) 40 30 20 10 0
10 100
IL=10mA IL=1.5A IL=500mA
V IN=4V COUT =10F V ripple=224mV
1000
10000
100000
1000000
Frequency (Hz)
G965 Max. Power Dissipation vs. PCB Top Copper Area
2.5 Max. Dissipation Power (W) 2.5 Max. Dissipation Power (W)
G965 Max. Power Dissipation vs. TAMB (still air)
Unit:in2
A=0.1
2
2
A=0.2 A=0.3 A=0.4
1.5
1.5
A=0.5 A=1.0 A=1.5
1
1
A=2.0 A=2.5 A=3.0
0.5
0.5
A=3.5 A=4.0 A=4.5
0 0 1 2 3 4 5 PCB Top Copper Area (in2)
0 25 35 45 55 TAMB (C) 65 75 85
A=5.0
Recommended Minimum Footprint
SOP-8
Ver: 1.5 Apr 01, 2005
TEL: 886-3-5788833 http://www.gmt.com.tw
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Global Mixed-mode Technology Inc.
Package Information
C
G965
E
H
L D 7 (4X)
A2 A1 e B
A
y
SOP-8 Package Note: 1. Package body sizes exclude mold flash and gate burrs 2. Dimension L is measured in gage plane 3. Tolerance 0.10mm unless otherwise specified 4. Controlling dimension is millimeter converted inch dimensions are not necessarily exact. SYMBOL
A A1 A2 B C D E e H L
MIN
1.45 0.10 1.35 0.306 0.153 4.81 3.84 ----5.84 0.45 0
DIMENSION IN MM NOM
1.60 ----1.45 ----------------1.27 -------------
MAX
1.75 0.25 1.55 0.506 0.253 5.01 4.04 ----6.24 1.00 8
MIN
0.057 0.004 0.053 0.012 0.006 0.189 0.151 ----0.230 0.018 0
DIMENSION IN INCH NOM
0.063 ----0.057 ----------------0.050 -------------
MAX
0.069 0.010 0.061 0.020 0.010 0.197 0.159 ----0.246 0.039 8
Taping Specification
PACKAGE
SOP-8
Feed Direction Typical SOP Package Orientation
Q'TY/REEL
2,500 ea
GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.
Ver: 1.5 Apr 01, 2005
TEL: 886-3-5788833 http://www.gmt.com.tw
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